GIGA-BYTE TECHNOLOGY CO., LTD.

Elevate your computing experience with GIGABYTE's renowned motherboard series: AORUS, AERO, and GIGABYTE. Featuring innovative designs and advanced features, these boards offer exceptional performance and reliability. Whether you're a gamer, content creator, or professional, our series cater to your needs, ensuring uncompromising quality and cutting-edge

B840M DS3H Motherboard - AMD Ryzen 9000 CPUs, 8+2+2 Phases VRM, up to 8200MHz DDR5, 2xPCIe 4.0 M.2, 2.5GbE LAN, USB 3.2 Gen 1

The manufacturer that produced the processor.

Processor manufacturer

Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.

Processor socket

A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.

Compatible processor series

The sockets (plugs) for processors that are supported (can be used) by the device.

Supported processor sockets

Processor

Types of memory which can be used with the product.

Supported memory types

Number of memory slots

A memory slot, also known as a memory socket or RAM slot, is what allows computer memory (RAM) to be inserted into the computer. Depending on the motherboard, there will usually be 2 to 4 memory slots (sometimes more on high-end motherboards). The most common types of RAM are SDRAM and DDR for desktop computers and SODIMM for laptop computers, each having various types and speeds.

Memory slots type

Memory channels

ECC сompatibility

Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.

Supported memory clock speeds

Supported memory clock speed (max)

The maximum internal memory which is available in the product.

Maximum internal memory

Unbuffered memory

Maximum internal memory per slot

Memory

The type of storage drives the device is compatible with.

Supported storage drive types

Supported storage drive interfaces

The total number of hard drives that can be used in/with this product.

Number of HDDs supported

How many storage drives can be fit into the product at once.

Number of storage drives supported

The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.

RAID support

RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.

RAID levels

Storage controllers

Parallel processing technology is the simultaneous use of more than one CPU or processor core to execute a program or multiple computational threads. Ideally, parallel processing makes programs run faster because there are more engines (CPUs or Cores) running it. In practice, it is often difficult to divide a program in such a way that separate CPUs or cores can execute different portions without interfering with each other. Most computers have just one CPU, but some models have several, and multi-core processor chips are becoming the norm. There are even computers with thousands of CPUs.

Parallel processing technology support

The maximum number of pixels that can be displayed in the image. It is usually quoted as width × height,: for example, "1024 × 768" means the width is 1024 pixels and the height is 768 pixels.

Maximum resolution

High-bandwidth Digital Content Protection (HDCP) is a form of digital copy protection to prevent copying of digital audio and video content as it travels across connections.

HDCP

DirectX is a collection of APIs (application programming interfaces) for easily handling tasks related to game programming on the Microsoft Windows operating system.

DirectX version

Graphics

The end of a cable with a USB 2.0 connector. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), in addition to the "USB 1.x Full Speed" signaling rate of 12 Mbit/s. USB 2.0 connectors are usually colored black.

USB 2.0 connectors

This is a connector (normally attached to a cable) for USB 3.0. USB 3.0 is the second major revision of the Universal Serial Bus (USB) standard for computer connectivity. First introduced in 2008, USB 3.0 adds a new transfer mode called "SuperSpeed," (distinguishable from USB 2.0 by either the blue colour of the port or the initials SS) capable of transferring data at up to 5Gbit/s—more than ten times as fast as the 480 Mbit/s top speed of USB 2.0.

USB 3.2 Gen 1 (3.1 Gen 1) connectors

Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.

Number of SATA III connectors

Front panel audio connector

Front panel connector

ATX Power connector (24-pin)

CPU fan connector

Number of CPU fan connectors

Number of chassis fan connectors

EPS power connector (8-pin)

Number of EPS power connectors (8-pin)

TPM connector

Number of water pump connectors

RGB LED pin header

Number of RGB LED pin headers

Internal I/O

Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.

USB 2.0 ports quantity

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity

Number of USB 3.0 (3.1 Gen 1) ports with Type-C connector. USB 3.0 (3.1 Gen 1) is USB interface version which supports transfer rate up to 5 Gbit/s (SuperSpeed). USB Type-C connector has symmetrical design architecture and compatible with Thunderbolt 3 interface.

USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity

Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device.  Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.

Ethernet LAN (RJ-45) ports

The number of PS/2 connectors for keyboards and mice. Its name comes from the IBM Personal System/2.

PS/2 ports quantity

The number of sockets (ports) for HDMI connections. HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transferring uncompressed video data and compressed/uncompressed digital audio data from a HDMI-compliant device ("the source device") to a compatible computer monitor, video projector, digital television, or digital audio device. HDMI is a digital replacement for existing analog video standards.

HDMI ports quantity

HDMI version

Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.

DisplayPorts quantity

DisplayPort version

Number of sockets /ports where headphones are connected.

Headphone outputs

Line-in

The socket where a microphone is connected to the device.

Microphone in

Rear panel I/O ports

An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.

Ethernet LAN

Ethernet interface type

LAN controller

Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.

Wi-Fi

Network

The chipset connects the microprocessor to the rest of the motherboard.

Motherboard chipset

Audio chip

An audio output channel is an electric circuit which acts as a path for a signal produced by a device. A device may have several audio output channels.

Audio output channels

The colour e.g. red, blue, green, black, white.

Product colour

PC health monitoring

What this product is used as a part of (component for).

Component for

Design of the motherboard (ATX, BTX etc).

Motherboard form factor

The category of motherboard chipset e.g. Intel, AMD.

Motherboard chipset family

The method used to cool the device or to cool the air around the device.

Cooling type

Power source type

Windows vesions wich can be used with the device.

Windows operating systems supported

Features

Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.

PCI Express x16 (Gen 3.x) slots

PCI Express x16 (Gen 4.x) slots

Number of M.2 (M) slots

1st M.2 largest key size

1st M.2 highest PCI Express generation

2nd M.2 largest key size

2nd M.2 highest PCI Express generation

Expansion slots

The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the  motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.

BIOS type

BIOS memory size

ACPI version

Clear CMOS jumper

Desktop Management Interface (DMI) version

System Management BIOS (SMBIOS) version

BIOS

Products per shipping (inner) case

Logistics data

Battery weight

Lithium weight per battery

Number of battery cells

The type of battery in the device, e.g. nickel–cadmium (NiCd).

Battery technology

Description of battery supplied with the product, such battery form factor (e.g. AA/AAA).

Battery type

Battery

The distance from one side of the packaging to the other.

Package width

The distance from the front to the back of the packaging.

Package depth

The distance from the top to the bottom of the packaging.

Package height

Package weight

Packaging data

The measurement or extent of something from side to side.

Width

The distance from the front to the back of something.

Depth

The measurement of the product from head to foot or from base to top.

Height

Weight & dimensions

Batteries included

Screws included

Software distributed with another product such as a piece of computer hardware or other electronic device, or a group of software packages which are sold together. A software suite is an example of bundled software, as is software which is pre-installed on a new computer.

Bundled software

Packaging content

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.

Weight

Other features

Warranty period

Technical details

GIGABYTE B840M DS3H Motherboard - AMD Ryzen 9000 CPUs, 8+2+2 Phases VRM, up to 8200MHz DDR5, 2xPCIe 4.0 M.2, 2.5GbE LAN, USB 3.2 Gen 1

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The official description of %%title%% as supplied by the manufacturer. For easy access to this data, refer to the "ProductDescription" block and the "LongDesc" tag in XML or the "Description" block and the "LongDesc" tag in JSON.
